Intercambiadores de calor pasivos que transfieren el calor generado por un componente electrónico a un medio fluido, a menudo aire o un refrigerante líquido, disipándolo fuera del dispositivo para mantener una temperatura de funcionamiento óptima. Están diseñados para maximizar la superficie en contacto con el medio que lo rodea. Suelen estar fabricados de cobre o aluminio debido a su alta conductividad térmica.
| Parte # | Fabricante | Descripción | Disponibilidad | Precios | Cantidad |
|---|---|---|---|---|---|
46454Heat Sinks | congatec | Heat Sink Passive | En stock | - | |
CONGA-MA5/CSP-THeat Sinks | congatec | Heat Sinks Passive cooling solution for COM Express Mini Type10 module conga-MA5 with open silicon Intel Pentium and Celeron processor. All standoffs are M2.5mm thread. | 15 | - | |
CONGA-TCA5/I-CSP-THeat Sinks | congatec | Heat Sinks Passive cooling solution for COM Express Compact module conga-TCA5 with lidded Intel Atom processor. All standoffs are M2.5mm thread. | En stock | - | |
SMX8-PLUS/HSP-BHeat Sinks | congatec | Heat Sinks Heat spreader solution for SMARC module conga-SMX8-Plus with NXP i.MX 8M Plus ARM processor. All standoffs are with 2.7mm bore hole. | En stock | - | |
CONGA-QMX6/HSP2-THeat Sinks | congatec | Heat Sinks STANDARD HEAT SPREADER QMX6 2MM | En stock | - | |
CONGA-QMX6/HSP1-THeat Sinks | congatec | Heat Sinks Standard heatspreader with 1mm gap pad for Qseven module conga-QMX6 with processors with LIDDED FCBGA package (PN: 016112, 016113). Threaded standoffs, M2.5. | 2 | - | |
HPC/CALS-HSP-HP-BHeat Sinks | congatec | Heat Sinks Standard heatspreader for COM-HPC module conga-HPC/cALS with integrated heat pipes, 13mm height. All standoffs are with 2.7mm bore hole. | En stock | - | |
ICX/CSPHeat Sinks | congatec | Heat Sinks Passive cooling for conga-IC87/IC97/IC170/IC175, 85L*85W*27H (mm) / 165 g, Aluminum, to be used with conga-ICx/Retention Frame PN 052254. | En stock | - | |
CONGA-B7E3/SP4-HSP-HP-THeat Sinks | congatec | Heat Sinks Standard heat spreader for high performance COM Express Type 7 module conga-B7E3 with integrated heat pipes. All stand-offs are M2.5 threaded. Suitable for all dual die variants. | En stock | - | |
CONGA-TC700/HSP-HP-BHeat Sinks | congatec | Heat Sinks Standard heatspreader for high performance COM Express module conga-TC700 with integrated heat pipes, 11mm height. All standoffs are with 2.7mm bore hole. | En stock | - | |
CONGA-HPC/CTLU-HSP-HP-THeat Sinks | congatec | Heat Sinks Standard heatspreader solution for high performance COM-HPC module conga-HPC/cTLU with integrated heatpipe, 13mm height. All standoffs are with M2.5mm thread. | En stock | - | |
CONGA-SA7/I-HSP-BHeat Sinks | congatec | Heat Sinks Standard heatspreader for SMARC 2.1 module conga-SA7 with lidded Intel Atom x6000E processors. All standoffs are with 2.7mm bore hole. | 5 | - | |
CONGA-TS170/CSA-HP-BHeat Sinks | congatec | Heat Sinks Standard active cooling solution for high performance COM Express modules conga-TS170/TS175/TS370 with integrated heat pipes, 15mm silver fins, 20mm overall heat sink height and integrated 12V fan. All standoffs are with 2.7mm bore hole. | En stock | - | |
TC670/HSP-HP-THeat Sinks | congatec | Heat Sinks Standard heatspreader for high performance COM Express module conga-TC670 with integrated heat pipes, 11mm height. All standoffs are M2.5mm threaded. | En stock | - | |
CONGA-MA5/I-HSP-BHeat Sinks | congatec | Heat Sinks Standard heatspreader for COM Express Mini Type10 module conga-MA5 with lidded Intel Atom processor. All standoffs are with 2.7mm bore hole. | 23 | - | |
CONGA-JC370/HSP-THeat Sinks | congatec | Heat Sinks Standard heatspreader for conga-JC370 (threaded). Total height 12mm. | En stock | - | |
CONGA-TS170/HSP-HP-BHeat Sinks | congatec | Heat Sinks Standard heatspreader for high performance COM Express modules conga-TS170/TS175/TS370 with integrated heat pipes. All standoffs are with 2.7mm bore hole. | En stock | - | |
CONGA-TCA3/HSP-BHeat Sinks | congatec | Heat Sinks Standard heatspreader for COM Express modules conga-TCA3 and TCA4. All standoffs are 2.7mm bore hole. | En stock | - | |
CONGA-QMX6/HSP3-THeat Sinks | congatec | Heat Sinks Standard heatspreader with heat stack solution for Qseven module conga-QMX6 for processors with open silicon FCBGA package (PN: 016102, 016103, 016104). Threaded standoffs, M2.5. | 154 | - | |
HPC/CALP-HSP-HP-THeat Sinks | congatec | Heat Sinks Standard heatspreader for COM-HPC module conga-HPC/cALP with integrated heat pipes, 13mm height. All standoffs are M2.5mm threaded. | En stock | - | |
CONGA-SA5/I-CSP-BHeat Sinks | congatec | Heat Sinks Passive cooling solution for SMARC 2.0 module conga-SA5 with lidded Intel Atom processor. All standoffs are with 2.7mm bore hole. | 32 | - | |
CONGA-TCA5/HSP-BHeat Sinks | congatec | Heat Sinks Standard heatspreader for COM Express Compact module conga-TCA5 with open silicon Intel Pentium and Celeron processor. All standoffs are with 2.7mm bore hole. | En stock | - | |
HPC/SILL-HSP-HP-BHeat Sinks | congatec | Heat Sinks Standard heatspreader for COM-HPC Server modules conga-HPC/sILL with integrated heat pipes and 11mm overall cooling height. Through hole mounting with bore hole standoffs 2.7mm. | En stock | - | |
CONGA-TCA7/HSP-BHeat Sinks | congatec | Heat Sinks Standard heatspreader for COM Express Compact module conga-TCA7 with open silicon Intel Pentium/Celeron J and N processors. All standoffs are with 2.7mm bore hole. | En stock | - | |
CONGA-QMX8-PLUS/HSP-THeat Sinks | congatec | Heat Sinks Heat spreader solution for Qseven module conga-QMX8-Plus with NXP i.MX 8M Plus ARM processor. All standoffs are M2.5mm thread. | En stock | - |