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Disipadores de calor
(163 resultados)Intercambiadores de calor pasivos que transfieren el calor generado por un componente electrónico a un medio fluido, a menudo aire o un refrigerante líquido, disipándolo fuera del dispositivo para mantener una temperatura de funcionamiento óptima. Están diseñados para maximizar la superficie en contacto con el medio que lo rodea. Suelen estar fabricados de cobre o aluminio debido a su alta conductividad térmica.
| Parte # | Fabricante | Descripción | Disponibilidad | Precios | Cantidad |
|---|---|---|---|---|---|
 CONGA-QA5/HSP-BHeat Sinks | congatec | Heat Sinks Standard heatspreader for Qseven module conga-QA5 with open silicon Intel Pentium and Celeron processor. All standoffs are with 2.7mm bore hole. | En stock | - | |
 TCV2/HSP-HP-THeat Sinks | congatec | Heat Sinks Standard heatspreader for high performance COM Express module conga-TCV2 with integrated heat pipes, 11mm overall heat sink height. All standoffs are M2.5mm thread. | En stock | - | |
 CONGA-TS570/HSP-HP-THeat Sinks | congatec | Heat Sinks Standard heatspreader for high performance COM Express module conga-TS570 with integrated heat pipes, 11mm overall heat sink height. All standoffs are M2.5mm thread. | En stock | - | |
CONGA-QA5/HSP-THeat Sinks | congatec | Heat Sinks Standard heatspreader for Qseven module conga-QA5 with open silicon Intel Pentium and Celeron processor. All standoffs are M2.5mm thread. | En stock | - | |
 CONGA-QA5/CSP-BHeat Sinks | congatec | Heat Sinks Passive cooling solution for Qseven module conga-QA5 with open silicon Intel Pentium and Celeron processor. All standoffs are with 2.7mm bore hole. | En stock | - | |
 CONGA-PA5/I-HSP-BHeat Sinks | congatec | Heat Sinks conga-PA5/i-HSP-B | 12 | - | |
 CONGA-SA7/HSP-BHeat Sinks | congatec | Heat Sinks Standard heatspreader for SMARC 2.1 module conga-SA7 with open-die Intel Pentium and Celeron J and N processors. All standoffs are with 2.7mm bore hole. | En stock | - | |
CONGA-HPC/MRLP-HSP-BHeat Sinks | congatec | Heat Sinks Standard heatspreader for COM-HPC module conga-HPC/mRLP. All standoffs are with 2.7mm bore hole. | En stock | - | |
 CONGA-B7E3/HSP-HP-THeat Sinks | congatec | Heat Sinks Standard heat spreader for high performance COM Express Type 7 module conga-B7E3 with integrated heat pipes. All stand-offs are M2.5 threaded. Suitable for all single die variants. | En stock | - | |
 CONGA-HPC/CTLH-HSP-HP-THeat Sinks | congatec | Heat Sinks Standard heatspreader solution for high performance COM-HPC module conga-HPC/cTLH with integrated heatpipe, 13mm height. All standoffs are with M2.5mm thread. | En stock | - | |
HPC/SILL-HSP-HP-THeat Sinks | congatec | Heat Sinks Standard heatspreader for COM-HPC Server modules conga-HPC/sILL with integrated heat pipes and 11mm overall cooling height. Threaded mounting with threaded standoffs M2.5. | En stock | - | |
 CONGA-MA7/HSP-THeat Sinks | congatec | Heat Sinks Standard heatspreader for COM Express Mini Type10 module conga-MA7 with open-die Intel Pentium/Celeron N and J processors. All standoffs are M2.5mm threaded. | En stock | - | |
 CONGA-MA5/I-HSP-THeat Sinks | congatec | Heat Sinks Standard heatspreader for COM Express Mini Type10 module conga-MA5 with lidded Intel Atom processor. All standoffs are M2.5mm thread. | 57 | - |
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