Intercambiadores de calor pasivos que transfieren el calor generado por un componente electrónico a un medio fluido, a menudo aire o un refrigerante líquido, disipándolo fuera del dispositivo para mantener una temperatura de funcionamiento óptima. Están diseñados para maximizar la superficie en contacto con el medio que lo rodea. Suelen estar fabricados de cobre o aluminio debido a su alta conductividad térmica.
| Parte # | Fabricante | Descripción | Disponibilidad | Precios | Cantidad |
|---|---|---|---|---|---|
015190Heat Sinks | congatec | Heat Sink Spreader | En stock | - | |
015536Heat Sinks | congatec | Standard Heat spreader for Qseven Module conga-QA5 with Open Silicon Pentium and Celeron processor | En stock | - | |
048053Heat Sinks | congatec | Standard Heat Spreader for COM Express Mini Type10 module conga-MA5 with lidded Atom processor | En stock | - | |
047532Heat Sinks | congatec | Standard Heat Spreader for High Performance COM Express Type 7 Module with integrated vapor chamber. All standoffs are M2.5mm thread | En stock | - | |
15192Heat Sinks | congatec | Standard Heat Spreader | En stock | - | |
CONGA-PA7/HSP-BHeat Sinks | congatec | Heat Sinks Heatspreader solution for conga-PA7 based on open silicon Intel Pentium and Celeron J and N processors. All standoffs are with 2.7mm borehole | 1 | - | |
CONGA-B7E3/SP4-HSP-HP-BHeat Sinks | congatec | Heat Sinks Standard heat spreader for high performance COM Express Type 7 module conga-B7E3 with integrated heat pipes. All stand-offs are bore hole. Suitable for all dual die die variants. | En stock | - | |
CONGA-JC370/HSP-BHeat Sinks | congatec | Heat Sinks Standard heatspreader for conga-JC370 (bore hole). Total height 12mm. | En stock | - | |
B7XI/HSP-HP-BHeat Sinks | congatec | Heat Sinks Standard heatspreader for COM Express Basic modules conga-B7XI with integrated heat pipes and 11mm overall cooling height. Through hole mounting with bore hole standoffs 2.7mm. | En stock | - | |
SMX8-X/I-HSP-BHeat Sinks | congatec | Heat Sinks Heat spreader solution for SMARC module conga-SMX8-X with lidded NXP i.MX 8X ARM processor. All standoffs are with 2.7mm bore hole. | 21 | - | |
CONGA-TCA5/CSP-BHeat Sinks | congatec | Heat Sinks Passive cooling solution for COM Express Compact module conga-TCA5 with open silicon Intel Pentium and Celeron processor. All standoffs are with 2.7mm bore hole. | En stock | - | |
HPC/CALS-HSP-HP-THeat Sinks | congatec | Heat Sinks Standard heatspreader for COM-HPC module conga-HPC/cALS with integrated heat pipes, 13mm height. All standoffs are M2.5mm threaded. | En stock | - | |
CONGA-MA5/I-CSP-THeat Sinks | congatec | Heat Sinks Passive cooling solution for COM Express Mini Type10 module conga-MA5 with lidded Intel Atom processor. All standoffs are M2.5mm thread. | 2 | - | |
CONGA-QA5/I-CSP-BHeat Sinks | congatec | Heat Sinks Passive cooling solution for Qseven module conga-QA5 with lidded Intel Atom processor. All standoffs are with 2.7mm bore hole. | En stock | - | |
CONGA-STDA4/CSP-BCONGA-STDA4/CSP-BHeat Sinks | congatec | Heat Sinks Standard heatspreader for SMARC Module conga-STDA4 based on TI ARM Jacinto 7 ARM | En stock | - | |
CONGA-QMX8/HSP-BHeat Sinks | congatec | Heat Sinks Standard heatspreader for Qseven module conga-QMX8 with lidded NXP i.MX 8 ARM Cortex-A72 processor. All standoffs are with 2.7mm bore hole. | En stock | - | |
CONGA-MA3/CSP-THeat Sinks | congatec | Heat Sinks Standard passive cooling solution for COM Express Type 10 modules conga-MA3 and MA3E with fins. All standoffs are M2.5mm thread. | En stock | - | |
CONGA-PA7/I-HSP-THeat Sinks | congatec | Heat Sinks Heatspreader solution for conga-PA7 based on lidded silicon Intel Atom x6000E processors. All standoffs are M2.5 thread. | 2 | - | |
CONGA-TC700/HSP-HP-THeat Sinks | congatec | Heat Sinks Standard heatspreader for high performance COM Express module conga-TC700 with integrated heat pipes, 11mm height. All standoffs are M2.5mm threaded. | En stock | - | |
CONGA-MA3/HSP-THeat Sinks | congatec | Heat Sinks Standard heatspreader for COM Express Type 10 modules conga-MA3 and MA3E. All standoffs are M2.5 thread. | En stock | - | |
CONGA-TCA5/HSP-THeat Sinks | congatec | Heat Sinks Standard heatspreader for COM Express Compact module conga-TCA5 with open silicon Intel Pentium and Celeron processor. All standoffs are M2.5mm thread. | En stock | - | |
CONGA-B7E3/HSP-HP-BHeat Sinks | congatec | Heat Sinks Standard heat spreader for high performance COM Express Type 7 module conga-B7E3 with integrated heat pipes. All stand-offs are bore hole. Suitable for all single die variants. | En stock | - | |
CONGA-MA7/HSP-BHeat Sinks | congatec | Heat Sinks Standard heatspreader for COM Express Mini Type10 module conga-MA7 with open-die Intel Pentium/Celeron N and J processors. All standoffs are with 2.7mm bore hole. | En stock | - | |
CONGA-PA7/I-HSP-BHeat Sinks | congatec | Heat Sinks Heatspreader solution for conga-PA7 based on lidded silicon Intel Atom x6000E processors. All standoffs are with 2.7mm borehole | En stock | - | |
CONGA-QA3/CSP-THeat Sinks | congatec | Heat Sinks Passive cooling solution for Qseven modules conga-QA3, QA3E and QA4. All standoffs are M2.5mm thread. | En stock | - |